Powder-free drop method "Kyosha-MAX"
Suppress powder drop from the fracture surface! Compatible with various single-sided, double-sided, and multilayer printed circuit boards.
"Kyosha-MAX" is a method developed in-house that allows for the clear punching of printed circuit boards, suppressing powder drop from the fracture surfaces, which is one of the foreign materials mixed in. It can accommodate various materials for single-sided, double-sided, and multilayer printed circuit boards. 【Features】 ■ Maintains a clean environment by suppressing powder drop ■ No need for powder drop prevention treatment during assembly ■ Reduces powder scattering and adhesion in terms of quality *For more details, please refer to the external link page or feel free to contact us.
- Company：京写
- Price：Other
